for cartons
Use:
- Multi-functional use in most production sites
Advantages:
- Flexible location with the movable frame
- Freely adjustable bead-to-spray application
- Low-level system and horn with interface to the PLC of the palletizer
- Closed system from the delivery container through the nozzles with integrated filter
- Change of delivery drum without stopping the production process
- Skip gluing of the top layer through interface of PLC
BAG FIX™ ESP 4
Use:
- Closed cabinet design allows use in dusty production sites
Advantages:
- Freely adjustable bead-to-spray application
- Low-level system and horn with interface to the PLC of the palletizer
- Closed system from the delivery container through the nozzles with integrated filter
- Change of delivery drum without stopping the production process
- Skip gluing of the top layer through interface of PLC
BAG FIX™ RM 30
Use:
- Bead application for cartons and paper bags
Advantages:
- Environmentally-friendly and aerosol-free application
- Cost-effective system
- Easy-to-handle
- Closed system from the delivery canister through the nozzles
- Movable unit with space for two 30kg canisters
BAG FIX™ ESP 2-EX
Use:
- Multi-functional use in explosion-hazardous production sites
Advantages:
- Flexible location with the movable frame
- Freely adjustable bead-to-spray application
- Low-level system and horn with interface to the PLC of the palletizer
- Closed system from the delivery container through the nozzles with integrated filter
- Change of delivery drum without stopping the production process
- Skip gluing of the top layer through interface of PLC
BAG FIX™ ESP 2-Central Unit
Use:
- Central unit supplies multiple application systems
Advantages:
- GRIP FIX™ supply and low-level system are centralized
- Adjustment of GRIP FIX™ application is at each conveyor line
- Low-level system and horn with interface to the PLC of the palletizer
- Closed system from the delivery container through the nozzles with integrated filter
- Change of delivery drum without stopping the production process
- Skip gluing of the top layer through interface of PLC